ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,425, issued on Sept. 16, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Electric vehicle charging controller and electric vehi... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,199, issued on Sept. 16. "Lifting pivot door" was invented by Paul Brous (West Palm Beach, Fla.). According to the abstract* released by ... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,471, issued on Sept. 16, was assigned to Tyco Fire & Security GmbH (Neuhausen am Rheinfall, Switzerland). "Network device and method with ... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,797, issued on Sept. 16, was assigned to T-Mobile Innovations LLC (Overland Park, Kan.). "Systems and methods for securing applications ex... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,566, issued on Sept. 16, was assigned to City University of Hong Kong (Kowloon, Hong Kong). "Convolution and transformer based compressive... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,611, issued on Sept. 16, was assigned to PRATT & WHITNEY CANADA CORP. (Longueuil, Canada). "Turbo-compounded engine with exhaust duct acou... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,846, issued on Sept. 16, was assigned to LENOVO (BEIJING) Ltd. (Beijing). "Electronic device" was invented by Chiehyen Chou (Beijing) and ... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,564, issued on Sept. 16, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas). "Enhanced account security monitoring" was in... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,327, issued on Sept. 16, was assigned to LG DISPLAY Co. LTD. (Seoul, South Korea). "Method for manufacturing high transmission light contr... Read More
ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,265, issued on Sept. 16, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Direct substrate to solder bump connection for thermal... Read More